SK Hynix has begun construction on a $4 billion advanced memory packaging facility in West Lafayette, Indiana, expected to reach full-scale operations by late 2028. The plant will manufacture high-bandwidth memory (HBM), a critical component for AI accelerators from Nvidia and AMD, reducing dependence on Korean suppliers. Production timing aligns with HBM4E standards and Nvidia's Rubin platform launch.
Infrastructure
SK Hynix’s aspirations for ’Merica-made HBM inch closer to reality
SK Hynix's $4B Indiana HBM fab locks in American production capacity for AI memory, breaking Korea's supply chain stranglehold on Nvidia and AMD's accelerator ecosystem.
Wednesday, April 22, 2026 12:00 PM UTC2 MIN READSOURCE: The RegisterBY sys://pipeline
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